JPH025505B2 - - Google Patents
Info
- Publication number
- JPH025505B2 JPH025505B2 JP25217384A JP25217384A JPH025505B2 JP H025505 B2 JPH025505 B2 JP H025505B2 JP 25217384 A JP25217384 A JP 25217384A JP 25217384 A JP25217384 A JP 25217384A JP H025505 B2 JPH025505 B2 JP H025505B2
- Authority
- JP
- Japan
- Prior art keywords
- track
- sprocket
- endless chain
- convex portion
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 23
- 229910000679 solder Inorganic materials 0.000 claims description 18
- 238000004140 cleaning Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims 1
- 230000004907 flux Effects 0.000 description 7
- 238000012423 maintenance Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Molten Solder (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25217384A JPS61129276A (ja) | 1984-11-29 | 1984-11-29 | 自動はんだ付け装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25217384A JPS61129276A (ja) | 1984-11-29 | 1984-11-29 | 自動はんだ付け装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61129276A JPS61129276A (ja) | 1986-06-17 |
JPH025505B2 true JPH025505B2 (en]) | 1990-02-02 |
Family
ID=17233504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25217384A Granted JPS61129276A (ja) | 1984-11-29 | 1984-11-29 | 自動はんだ付け装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61129276A (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5445605B2 (ja) | 2011-08-30 | 2014-03-19 | 第一精工株式会社 | プレスフィット用コネクタ端子 |
-
1984
- 1984-11-29 JP JP25217384A patent/JPS61129276A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61129276A (ja) | 1986-06-17 |
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